Metal reticle for screen printing

Patent Name Metal reticle for screen printing Patent applicant SMK Co., Ltd. Principal applicant Address Tokyo, Japan Inventor Imai Ichiro; Yamaguchi Yoshiaki; Saito Fujioka; Nakayama Sangmei Application (Patent) No. 200410081787.5 Date of Application 2004.12.29 Certification Date Approval Notice No. 1680873 Auditing Notice Day 2005.10.12 Manual Disc No. D0541 Main Classification No. G03F1/00 Classification No. G03F1/00; G03F7/00; H01L21/56 Division Original Application No. 2004.4.6 JP 2004-111771 Digest 1 The metal reticle for screen printing and the through hole (2) for forming a resin inflow space (4) between the periphery of the electronic component (120) include a small hole (2B) on the lower side and an upper large diameter hole communicating therewith (2A) Structure, The step part (6) is formed in the through hole (2). When the metal mask (1) for screen printing is removed, only the inner side of the lower small-diameter hole (2B) is in contact with the sealing resin (3) attached to the electronic component (120), so that the cutting area is small and the sealing resin is small. (3) It is separated before the horny process occurs. With the present invention, horny protrusions are less likely to occur. Sovereignty Item 1. A metal mask for screen printing, in which a through hole (2) for accommodating all electronic components (120) mounted on a base plate (102) is formed on the metal mask plate for screen printing. After the metal mask for screen printing is overlaid on the base plate (102), the resin inflow space (4) formed between the periphery of the electronic component (120) and the through hole (2) is filled with the sealing resin (3), and then, The metal mask for screen printing is removed from the base plate (102), and the sealing resin (3) is adhered to the periphery of the electronic component (120), which is characterized by at least the electronic components mounted on the base plate (102). On the thicker screen printing metal reticle (1) of (120), a through hole (2) composed of a lower small-diameter hole (2B) and an upper large-diameter hole (2A) is formed. The outline of the hole (2B) is located outside the outline of the electronic component (120) projected on the base plate (102), and is separated from the outline of the electronic component by an interval equivalent to the thickness (d) of the sealing resin (3) to be attached. The upper large-diameter hole (2A) is communicated above the lower small-diameter hole (2B), and the outline thereof includes the outline of the lower small-diameter hole (2B), and the lower trail within the through hole (2). A boundary between (2B) and the upper side of the large-diameter hole (2A) is formed with a stepped portion (6). International Application International Publication Entering Country Date Patent Agency Shanghai Patent & Trademark Office Co., Ltd. Agency Address Agent Fang Xiaohong