Printing substrate and printing substrate processing method and printing substrate manufacturing method

Patent name: Processing method of printed circuit board and printed circuit board and manufacturing method of printed circuit board Patent applicant: Hitachi Plant Machinery Co., Ltd. Principal applicant address Kanagawa inventor Arakawa Koufu; Akashi Harumi Application (patent) No. 200510069018.8 Date of application 2005.04.29 Certification Date Approval Notice No. 1694606 Date of Publication Approval 2005.11.09 Specification CD-ROM D0545 Main Classification Number H05K3/46 Classification Number H05K3/46; H05K1/02; H05K3/12 Distribution Original Priority No. 2004.4.30 JP 2004- 136905 Abstract The present invention provides a method of processing a printed circuit board and a printed circuit board, and a method of manufacturing a printed circuit board, which are capable of increasing the mounting density of a printed circuit board and reducing the manufacturing cost, and have uniform processing quality. On the surface of the conductor layer of the first layer F of the printed circuit board in which conductor layers and insulating layers are alternately laminated, a cover layer is designed, which absorbs laser light, but is insoluble in the etching liquid that dissolves the conductor layer. In this case, the cover layer may also be designed on the surface of the inner conductor layer. In addition, the material of the conductor layer may be a substance mainly composed of copper. The main material of the cover layer may be copper oxide, and the thickness of the cover layer may be greater than or equal to 0.6 micron. SAUDIENCE CLAIM 1. A printed circuit board, characterized in that a cover layer is formed on a surface of a conductor layer of a first layer of a printed circuit board in which conductive layers and insulating layers are alternately laminated, which can absorb laser light but is insoluble in the etching for dissolving the conductor layer. liquid. International Application International Publication Entering Country Date Patent Agency Beijing Yinlong Intellectual Property Agency Co., Ltd. Agency Address Zhang Jingqiang